Advanced Packaging & Integration Lead
Lead development of advanced 3D packaging and integration for multi-chip spin-qubit silicon devices. Work within a multidisciplinary R&D team shaping packaging architecture for scalable quantum processors.
What you'll do
- Define strategy and architecture for 3D integrated circuits and multi-chip modules
- Design packaging using TSVs, fine-pitch micro-bumps, and flip-chip bonding
- Validate thermal, mechanical, and electrical performance down to millikelvin temperatures
- Develop DC and RF simulation approaches for signal, power, thermal, and stress analysis
- Manage technical transfers and collaborate with suppliers, OSATs, and research partners
What they're looking for
- Master's or PhD in relevant engineering or science field
- 7+ years in 3D integration and advanced packaging
- Experience with 3D-IC layout and multi-die co-design tools
- Experience with Ansys HFSS/Q3D or equivalent multi-physics tools
- Experience managing technical transfers with external packaging facilities
Skills
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